SEGA MODEL 3 STEP 2.0
硬件规格：
Main CPU : 32bits RISC PowerPC 603ev 166Mhz
Graphics Chip : 2 x Lockheed Martin Real3D/PRO-1000
Sound CPU : 16bits 68EC000 11.3Mhz
Sound chip : Yamaha SCSP/YMF-292F/"LAKE" FH1 128-step DSP x 2, MIDI interface, 16 bits 64 voices 4 channel, maximum of 16.5 Mbytes ROM, 64 PCM channels
Audio RAM : 1meg (8 megabits, 512K per SCSP chip)
Main Memory : 8 Mbytes 66mhz Ram, graphic ROM maximum of 64 Mbytes, backup RAM 64 Kbytes
Video resolution : 24KHz 496(H)x384(V) one or two plane 24khz, It uses the VGA pinout however. And, the voltage levels of the video output is at VGA levels (.7vdc Peak to Peak)
Scroll Window : two plane (24KHz/two plane mode), 16 colours/32,768 1024 palette x 2 bank, 256/32,768 64 palette x 2 bank
Geometrizer : At least 1,000,100 polygons/s for square polys, 2,000,200 for Triangle polys
Renderer : At least 60,000,000 pixels/s
Video : Full Color Texture Mapping, Tri-Linear Interpolation, Micro Texture, Shading High-Specula Gouraud Shading , Fix Shading, Flat Shading, Texture & Edge Multi Layered Anti-Allasing, Lighting Effects, Parallel Light, 4 Spot Light, Pin Spot Light, Special Effect Zoning-Fog, 32 Levels of Translucency.
Board composition : CPU + VIDEO + ROM boards
Others : 10mbs Connection, calendar IC

OPTIONAL MPEG SOUND BOARD DESCRIPTION
Hardware : DSB1
CPU : Z80
Sound Chip : NEC uD65654GF102
Notes : Can play back music in stereo or can stream mono music from left and right channels seperately. Hardware : DSB2
CPU : 68k
Sound Chip : NEC uD65654GF102
Notes : Can play back music in stereo or can stream mono music from left and right channels seperately.

Board picture : Full board
High Quality Board pictures : Main Board - Main Board 2 - Main Board 3
Notes : With Model 3, Sega decided to design a new system from the ground up. Again, going with the company that they had formed a good relationship with, now named Lockheed Martin's Real3D division (Martin Marietta had now merged with Lockheed to form Lockheed Martin and Real3D was created from the combined 3D graphics resources of MM and Lockheed's own). They were brought in to assist in developing the brand new graphics subsystem, which ended up being the twin Real3D/Pro-1000 chipset, stunningly powerful for their time.



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